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Detail produk:
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| Indeks Bias: | 1.51-1.625 | Kondisi Penyembuhan: | 600 mJ/cm² (UV) |
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| Ketahanan Suhu: | -50°C hingga 150°C | Substrat: | PCB, Plastik, Kaca, Logam |
| Penampilan: | Cairan bening atau berwarna | Kondisi Sembuh: | 1200mJ/cm2 |
| Konstanta dielektrik: | Rendah | Tiksotropi: | Tinggi, visibilitas bagus |
| Kondisi penyimpanan: | Simpan di tempat yang sejuk dan gelap | Pilihan Penyembuhan: | UV LED, Kelembapan UV, Termal UV |
| kandungan silikon: | Bebas Silikon | Metode aplikasi: | Mengeluarkan, menyikat, atau menyemprot |
| Perpanjangan Saat Istirahat: | 150% | Toksisitas: | VOC rendah, umumnya aman jika diawetkan |
| Berat: | 1KG | ||
| Menyoroti: | 3166 UV adhesive solder joint protection,UV cure adhesive solder joint,3166 UV cure adhesive |
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3166 UV Adhesive for Solder Joint Protection Product Features: Medium-high viscosity Excellent surface and deep curing performance Thixotropic properties with excellent dispensing characteristics Excellent adhesion to a wide range of materials, including plastics, metals, and glass Suitable for electronic solder joint protection and reinforcement of various wires and cables Color: Transparent Amber Viscosity (at 25°C): 6,000 ± 500 mPa·s Curing Condition: 400 mJ/cm² Hardness:
Kontak Person: Eric Hu
Tel: 0086-13510152819