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Detail produk:
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| Warna: | Hitam Transparan | Viskositas (25°C): | 6000±1000 mPa.s |
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| Kondisi penyembuhan: | 600 mJ/cm2 (LED UV) | Kekerasan: | Pantai D 40 |
| Suhu transisi gelas (Tg): | 10°C | Kekuatan dielektrik: | 20 KV/mm |
| Umur Simpan: | 12 bulan (8-28°C) | Kemasan: | 50g / 1kg |
| Aplikasi: | Pengakuan chip BGA, fiksasi bawah komponen | ||
| Menyoroti: | UV curable adhesive for BGA chips,Fast curing UV adhesive high adhesion,UV cure adhesive component bottom fixation |
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Fast Curing UV Curable Adhesive Fast Curing UV Curable Adhesive is a transparent black, LED-curable adhesive specially formulated for BGA chip stiffening and component bottom fixation. It offers high adhesion with excellent flexibility, low shrinkage and low dielectric constant, high thixotropy with good color visibility for easy dispensing, and LED 3-5 second fast curing, delivering reliable stiffening and protection for sensitive electronic components. Key Features Fast
Kontak Person: Eric Hu
Tel: 0086-13510152819
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